WCC800 Coating Equipment Sputter Deposition Process
Ion Source
- High-energy plasma for surface cleaning
- Atomic-level etching without affecting roughness;
- Easy maintenance
Unbalanced magnetic field design for high target utilization;
- Coating type: Cr、WC/C、TiAlN etc
- Coating type: Cr, WC/C, TiAlN etc
- Providing better coating quality
- Lower film stress
| Model | WCC800 |
|---|---|
| Technology | 1DCMS+3HiPIMS |
| Coating Type | Cr、WC/C、TiAlN, etc |
| Etching | SET |
| Number of Cathodes | 4 |
| Dimension(LWH:mm) | 3750 × 1800 × 2500 |
| Chamber Volume (m³) | 0.8 |
| Coating Volume (mm) | Φ650 × 400 |
| Loading Capacity(trees) | 8/or per customer request |
| Max Loading (KG) | 350 |
| Spindle Diameter (mm) | Φ170 |
| Process Time (h) | 4~5 |




HD500
