Etching Technology
Special designed magnetic field that surround the sample system evenly
Excellent homogeneity of etching
Good diffraction
Tunable etching strength
Etched modules are maintenance-free

Arc ion plating(AIP)
High ionization rate
High density
High deposition rate
Many microparticle
Rough surface

G4 integrated cathode
High ionization rate
High density
High deposition rate
Smooth surface, no microparticles
Low residual stress

Magnetron sputtering (MS)
Smooth surface, no microparticles
Low residual stress
Low deposition rate
Low ionization rate
PECVD Coating Technology
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process that deposits extremely smooth, adherent amorphous diamond hard alloy coatings in a highly vacuum environment. Compared to PVD processes, PECVD processes use deep plating power supplies, do not require cathode targets, and the workpiece does not need to rotate in the furnace chamber. This process is a clean, pollution-free, reliable, and multifunctional coating process.
● Simple hardware, no additional ionization source required
● Composite magnetic field design, increasing ionization rate
● High deposition speed>1μm/h
● Low deposition temperature <250℃
● Smooth surface, no large microparticle contamination
● Plasma cleaning products, maintenance-free

Simulation of non-equilibrium closed magnetic field

High-density plasma

Plasma cleaning products
PECVD(for a-C:H)
Based on the requirements for wear resistance, lubrication, corrosion resistance, and high bonding strength of parts, the DLC coating is structurally designed based on the concept of multi-layer structure, gradient transition, and interface composite.

DLC Coating structure

Thickness 2-4μm (depends on different requirement)


HD500