ALD
Atomic Layer Deposition (ALD)
Atomic layer deposition is a thin-film deposition process
based on sequential, self-limiting surface reactions.
Separate precursor and reactant exposures, with purge
steps between them, build films through repeated cycles.
ALD thin films are used in semiconductor applications
such as high-k dielectrics, surface passivation, and
diffusion barriers. ALD coating can also provide
protective barrier layers for selected equipment
components. Film material, geometry, and service
conditions determine the appropriate process.
DLC
Diamond-Like Carbon (DLC)
DLC coatings provide low-friction, wear-resistant
surfaces for precision semiconductor equipment
components. Applications include shafts, pins,
sleeves, and sliding parts.
Coating selection considers contact conditions,
substrate material, surface finish, dimensional
tolerances, and operating temperature. Components
exposed to process chemicals or plasma require
additional compatibility assessment.
ta-C
Tetrahedral Amorphous Carbon (ta-C)
ta-C is a hard carbon coating used for components
requiring high wear resistance and controlled
surface properties. It can support demanding
precision contact applications where substrate
support and coating adhesion are suitable.
Coating thickness, residual stress, surface finish,
and component geometry must be considered when
selecting a ta-C solution.