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The application of coatings in the semiconductor industry

2025-07-24

With the continuous advancement of the semiconductor manufacturing industry, where process technologies have progressed to 3nm and below, the requirements for semiconductor components have become increasingly stringent.  

- Nanoscale particulate contamination during processing has a particularly severe impact on sub-3nm chip manufacturing.  

- Wear and electrostatic accumulation significantly reduce the lifespan of components such as planetary wheels and wafer chucks, necessitating frequent downtime for cleaning and severely impacting production efficiency.  

- Traditional metal or ceramic coatings tend to generate particles due to friction, failing to meet current precision requirements and leading to reduced chip yield.  

DLC coatings with a thickness of 2–3 μm, fabricated using PECVD technology, offer critical advantages: 

- Low deposition temperature minimizes substrate thermal deformation.  

- High hardness (2,200–2,700 HV) and toughness ensure durability in acidic/alkaline environments.  

- Smooth, wear-resistant surface prevents debris and particle generation during friction.  

- High resistivity (10⁶–10⁸ Ω·cm) provides anti-static properties.  

The application of coatings in the semiconductor industry.jpg

Replacing traditional coatings with wear-resistant, high-resistivity DLC coatings delivers transformative improvements:  

1. Nanoparticle Control  

- Magnetron-sputtered DLC coatings achieve superior surface roughness and friction coefficients (CoF), reducing wear during wafer processing.  

- Particulate contamination is controlled within **Class 1 standards**.  

2. Component Longevity  

- CoF on planetary wheels drops **below 0.12**, extending service life by **4–6×**.  

3. Electrostatic Mitigation  

- Optimized resistivity (10⁶–10⁸ Ω·cm) minimizes electrostatic accumulation.  

- Reduces airborne particle adsorption and ESD damage, improving product yield.  

4. Thermal Stability  

- PECVD’s low-temperature deposition prevents thermal deformation in thin semiconductor components (e.g., planetary wheels).  

Coating material Coating thickness Microhardness Binding force Coefficient of friction Service temperature Deposition temperature Coating color
DLC 2-4μm(as per product requirements) ≈2500HV HF1 ≈0.1 <300℃ <200℃ black